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Ten Chinese Packages For Integrated Circuits Suppliers Popular in European and American Countries

June 23, 2024
Packages for integrated circuits are essential components that house and protect the delicate semiconductor chips. They come in various forms such as DIP, QFP, BGA, and more, providing electrical connections and thermal management for the ICs. The market is driven by the increasing demand for compact and high-performance electronic devices.

DIP (Dual In-line Package)

Establishment time : 1962

website : www.ti.com

Main Product : Integrated circuits, microcontrollers, analog chips

Company Profile

Texas Instruments is a leading manufacturer of semiconductor products for a variety of industries, including automotive, industrial, and consumer electronics. With a long history of innovation and a strong global presence, Texas Instruments continues to be a major player in the semiconductor industry.

Shaanxi Xinlong Metal Electro-mechanical Co., Ltd.

Establishment time : 2002

website : www.cnxlalloys.com

Main Product : Tungsten Heavy Alloys,Heat Sink,Electronic Packaging,Rhenium Alloys,Tantalum Alloys,Nickel Based Braze Alloy

Company Profile

Founded in 2002 in the historic and culturally rich city of Xi'an, Shaanxi Province, Shaanxi Xinlong Metal Electromechanical Co., Ltd. stands today as a testament to innovation and excellence in the field of high-tech materials, particularly in tungsten-based high-density products. Nestled in a region famed for its scientific and industrial prowess and as the birthplace of the Silk Road, our company embodies the spirit of exploration and advancement.



At Shaanxi Xinlong, our journey over the last two decades has been marked by a relentless pursuit of quality and precision. Specializing in electronic packaging tube casing and thermal sink materials, we have established ourselves as a premier provider of high-density tungsten, molybdenum, tantalum, niobium, and rhenium products. Our offerings are not just products; they are solutions tailored to meet the exacting standards of industries that shape our world – from aerospace and electronics to medical, energy, and automotive sectors.


Collaboration with leading Chinese research institutes and military production enterprises has been a cornerstone of our growth, enabling us to harness cutting-edge technologies and expertise. This synergy drives our commitment to innovation, seen in our range of products that include silver-based soldering materials and alloys designed for high reliability and performance.


Understanding the challenges of our clients, we pride ourselves on being more than just a supplier. We are problem-solvers, dedicated to finding and developing new materials that address the specific needs of both military and civilian applications. Our focus is on delivering solutions that are not only high in precision and quality but also steeped in technical sophistication.


Join us at Shaanxi Xinlong Metal Electromechanical Co., Ltd., where tradition meets innovation, and every product is a step towards the future of high-density, high-tech materials.


BGA (Ball Grid Array)

Establishment time : Amkor Technology - Established in 1968

website :

Main Product : Advanced Semiconductor Engineering (ASE) - Established in 1984

Company Profile

Micron Technology - Established in 1978

SOIC (Small Outline Integrated Circuit)

Establishment time : Company: Texas Instruments

website :

Main Product : Company: ON Semiconductor

Company Profile

Company: STMicroelectronics
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Author:

Ms. Zhao

Phone/WhatsApp:

+86 13991390727

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Author:

Ms. Zhao

Phone/WhatsApp:

+86 13991390727

Populyar Məhsullar
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